Unisem plans RM396 million expansion at Gopeng semiconductor plant
The second phase will add wafer-bumping and post-bump capacity to serve demand for advanced packaging in AI, data centres and high-performance computing.
Unisem (M) Bhd and its subsidiary plan to invest RM396 million in a second expansion phase at the group's Gopeng semiconductor plant in Perak, according to the company's Bursa Malaysia filing.
The plan includes a new production building costing an estimated RM196 million, with approximately 40,000 sq m of built-up space. Unisem Advanced Technologies Sdn Bhd, its wholly owned subsidiary, will lease half of the building for an expansion of wafer-bumping operations.
Equipment purchases and work to prepare the facility are expected to require another RM200 million. Unisem said the additional wafer-bumping and post-bump capacity would address rising customer demand for advanced packaging, particularly in AI, data centres and high-performance computing.
The group intends to use funds generated internally alongside bank loans to finance the project, but has not determined the funding mix. It expects no material earnings impact in the current financial year, with a positive contribution anticipated after the expansion is completed and begins operating.
Construction of the earlier Gopeng facility started in March 2022. That first phase carried an initial cost estimate of RM300 million and was intended to double capacity relative to the group's existing Ipoh operations.
